- Covers gaps
The low viscosity of XTM50 allows it to easily fill microscopic grooves and channels for maximum thermal transfer.
- Easy installation
The included stencil and application tool help with precise application of XTM50 to your CPU.
- Reliability and safety
The high stability of XTM50's liquid compound lasts for years without drying out or changing in density. It does not contain volatile organic compounds.
- Weight: 5g
- Thermal conductivity: 5 W/mK
- Thermal resistance: 0.009°C -in2/W
- Viscosity (@.25°C): 2300K cPs
- Specific gravity: 2.7g/cm3